ege-com® Macroduct Multi-M, -S and –L

ege-com^® Macroduct Multi-M, -S and –L

Pipe bundle system made of ege-com^® Macroducts

Brief description

ege-com^® Macroduct Multi pipes are an assembly of several cable protection pipes from the ege-com^® Macroduct Mono range joined to make a composite pipe. This consists of several pipes with the same or different dimensions, which can be assembled according to user requirements.

Product Benefits | Product Structure

Wide range of colours: The basic pipe is black and can be supplied with a coloured outer layer and/or stripes.
Various bundles possible: with sheathing (-M), back-to-back Joint (-S) or loosely wound (-L).
Multi-M:

available as inliner or direct buried
single pipes are manufactured according to given standards
labelling of the inner pipe as well as various colours possible

Installation options

open trench installation in sandbed

insertion in cable protection pipes / conduit tiles(Multi -M)

System Technology

egeplast offers complete piping systems: You can find the extensive range of accessories in the catalogue “ege-com^® accessories”.

plug-in connections, clamped and screw-in connections	tools	seals

At a glance

Applications	Protection of telecommunication cables (e.g. copper or fibre optic cables)
Target Groups	Network operators \| Construction companies
Dimension	Inliner version: 32 to 40 mm; 3-way and 4-way Direct buried version: 32 – 50 mm; 2-way to 4-way
Medium	Telecommunication cable
Material	PE-HD
Bundles	Multi-M: A polyolefin sheathing secures the Macroducts. Multi-S: The Macroducts are joined using a back-to-back joint Multi-L: Several Macroducts will be wound up loosely together.
Connection Technology	Plug-in connections, clamped and screw-in connections
Approval/Standards	Following DIN 8074 (PE 100), according to DIN 16874, according to DIN 16876
Product Limitations	Bundles of max. 5 Mono pipes

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Variants

Macroduct Mono Dimension 32 – 63 mm	Special Applications SLA^®, SLM^®, DCT	Special Applications OD (detection wire), with integrated RFID chip